28-29 March 2016 :: Notification of Paper Acceptance Email will be sent.
1 May 2016 :: Submission of Manuscript
20 May 2016  27 May 2016 :: Submission of Final Manuscript

Registration is Open

Preliminary Program is available

Exhibitor List and Booth Locations are updated

Welcome to IPFA 2016 Website!

The 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

IPFA 2016 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.


Best Paper for FA:
Fault Isolation using Electrically-enhanced LADA (EeLADA)
Szu Huat Goh, Boon Lian Yeoh, Guo Feng You, Hu Hao, Wei Liang Sio, Jeffrey Lam, and Choon Meng Chua (GLOBALFOUNDRIES Singapore Pte Ltd., Singapore)

Best Paper for Reliability:
UTB GeOI 6T SRAM Cell and Sense Amplifier considering BTI Reliability
Vita Pi-Ho Hu, Pin Su, and Ching-Te Chuang (Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Taiwan)



With a wide range of experiences that each FA engineer has, there needs to be a platform which promotes an exchange of ideas, experiences, innovations and applications of different techniques in unique ways and where there are opportunities for everyone to learn and gain something beneficial from others present. IPFA provides such a platform. Everything from the tutorials, the paper presentations to the vendor exhibits have one motive – that people take back something that is useful and can be applied to the way engineers go about everyday work, albeit a little differently – so that the overall quality and success rate of the FA work are improved. It always feels great to attend IPFA!

Dnyaneshwar Khatri
Senior Product Development Engineer
Advanced Micro Devices, Singapore

The conference exceeded my expectations, great opportunity to hear new ideas and get useful information.

Wang Daxiang
Process Integration
MTS Technology Development, Global Foundry

I have been exhibiting at IPFA since mid-2000, while working for 5 different companies and continue to do so for my own company, LatticeGear.  Being part of the Failure Analysis community, as an equipment, process or chip manufacturer, there are only very few technical events that offer the opportunity to learn, get updated, interact with other users and industry experts and attend live demonstrations – IPFA is the one covering Asia. For vendors in this nitch market, it is an opportunity to present their latest products, learn about the latest in the industry, get feedback from tools’ owners, interact with decision makers as well as with other vendors. Being such a focused conference with such technical content attract new comers who need to learn and establish their network, as well as expert veterans. As an exhibitor, I feel that we get our money worth because the leads generated, although not high in number are quality, relevant, well targeted leads that return the investment.

Efrat Moyal
LatticeGear LLC

I have been attending IPFA since 2012 and it’s an excellent platform for technical learning and networking with experts from failure analysis community. It’s the quality of papers and wide range of topics that attracts me year after year. As an author/presenter, IPFA would be my first choice to showcase my work because of their genuinity in recognizing and appreciating good works. Last but not least, IPFA exhibition is an event where top equipment vendors are assembled under one roof to showcase their capability.

Dayanand Nagalingam
Senior Engineer, Product EFA Team