Established in 1995, the International Symposium on the Physical and Failure Analysis of Integrated Circuits brings together global experts to explore the evolving challenges in reliability, process integrity, and physical diagnostics of integrated circuits and semiconductor devices.

Backed by IEEE and a world-class technical committee, IPFA fosters collaboration between academia, research institutions, and industry. The symposium focuses on the latest in failure mechanisms, testing methodologies, materials analysis, and emerging technologies impacting IC reliability.

With annual events hosted in Asia and growing global participation, IEEE-IPFA is more than a conference — it’s a trusted community dedicated to pushing the boundaries of electronic device integrity.